Foldable Flex and Thinned Silicon Multichip Packaging Technology

Foldable Flex and Thinned Silicon Multichip Packaging Technology

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Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.can be enabled/disabled via a DIP switch setting; this allows maximum flexibility for configuration. The victim lines are ... A simplified substrate schematic. driver chips are surrounded by surface mount decoupling capacitors. DIP switches and anbsp;...


Title:Foldable Flex and Thinned Silicon Multichip Packaging Technology
Author: John W. Balde
Publisher:Springer Science & Business Media - 2013-11-27
ISBN-13:


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